Three-dimensional semiconductor memory devices

ABSTRACT

3D semiconductor memory devices may include a horizontal structure that may be on an upper surface of a substrate and may include first and second horizontal patterns sequentially stacked on the upper surface of the substrate, a stack structure including electrodes stacked on the horizontal structure, a vertical pattern extending through the electrodes and connected to the first horizontal pattern, and a separation structure intersecting the stack structure and the horizontal structure and protruding into the upper surface of the substrate. A lowermost electrode may have first inner sidewalls facing each other with the separation structure interposed therebetween. The second horizontal pattern may have second inner sidewalls facing each other with the separation structure interposed therebetween. A maximum distance between the first inner sidewalls in the first direction may be less than a maximum distance between the second inner sidewalls in the first direction.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application claims priority under 35U.S.C. § 119 to Korean Patent Application No. 10-2020-0033416, filed onMar. 18, 2020, in the Korean Intellectual Property Office, thedisclosure of which is hereby incorporated by reference in its entirety.

BACKGROUND

Embodiments of the inventive concepts relate to three-dimensional (3D)semiconductor memory devices and, more particularly, to 3D semiconductormemory devices with improved reliability and integration density.

Semiconductor devices have been highly integrated to provide excellentperformance and low manufacturing costs. The integration density ofsemiconductor devices may directly affect the costs of the semiconductordevices, thereby increasing demand for highly integrated semiconductordevices. The integration density of two-dimensional (2D) or planarsemiconductor devices may be mainly determined by an area where a unitmemory cell occupies. Therefore, the integration density of the 2D orplanar semiconductor devices may be greatly affected by a technique offorming fine patterns. However, since extremely high-priced apparatusesmay be used to form fine patterns, increases in the integration densityof 2D semiconductor devices may be limited. Thus, three-dimensional (3D)semiconductor memory devices have been developed to overcome the abovelimitations. 3D semiconductor memory devices may include memory cellsthree-dimensionally arranged.

SUMMARY

Embodiments of the inventive concepts may provide three-dimensional (3D)semiconductor memory devices capable of improving reliability andintegration density.

According to some embodiments of the inventive concepts, 3Dsemiconductor memory devices may include a horizontal structure that maybe on an upper surface of a substrate and may include a first horizontalpattern and a second horizontal pattern that may be sequentially stackedon the upper surface of the substrate in a vertical direction, a stackstructure including a plurality of electrodes stacked on the horizontalstructure in the vertical direction, a vertical pattern extendingthrough the plurality of electrodes and connected to the firsthorizontal pattern, and a separation structure intersecting the stackstructure and the horizontal structure and protruding into the uppersurface of the substrate. A lowermost electrode of the plurality ofelectrodes may have first inner sidewalls that may face each other andmay be spaced apart from each other in a first direction with theseparation structure interposed therebetween, and the second horizontalpattern may have second inner sidewalls that may face each other and maybe spaced apart from each other in the first direction with theseparation structure interposed therebetween. A maximum distance betweenthe first inner sidewalls in the first direction may be less than amaximum distance between the second inner sidewalls in the firstdirection.

According to some embodiments of the inventive concepts, 3Dsemiconductor memory devices may include a substrate including a recessin an upper surface thereof, a stack structure including a plurality ofelectrodes stacked on the upper surface of the substrate in a verticaldirection, a horizontal structure that may be between the stackstructure and the substrate and may include a first horizontal patternand a second horizontal pattern that may be sequentially stacked on theupper surface of the substrate in the vertical direction, and aseparation structure intersecting the stack structure and the horizontalstructure in a first direction parallel to the upper surface of thesubstrate. A portion of the separation structure may be in the recess ofthe substrate. The first horizontal pattern may have first innersidewalls that may face each other and may be spaced apart from eachother in a second direction that may be perpendicular to the firstdirection with the separation structure interposed therebetween. Amaximum width of the recess in the second direction may be greater thana maximum distance between the first inner sidewalls in the seconddirection.

According to some embodiments of the inventive concepts, 3Dsemiconductor memory devices may include peripheral logic circuits on alower substrate, a lower insulating layer on the peripheral logiccircuits, a substrate on the lower insulating layer and including arecess in an upper surface thereof, a stack structure including aplurality of electrodes vertically stacked on the upper surface of thesubstrate, a horizontal structure that may be between the stackstructure and the substrate and may include a first horizontal patternand a second horizontal pattern that may be sequentially stacked on theupper surface of the substrate, a vertical pattern extending through theplurality of electrodes and connected to the first horizontal pattern, aseparation structure intersecting the stack structure and the horizontalstructure in a first direction parallel to the upper surface of thesubstrate and including a portion in the recess of the substrate, aninterface layer between the first horizontal pattern and the secondhorizontal pattern, and a first insulating layer between the substrateand the separation structure in the recess. The interface layer mayextend on a first portion of a top surface of the first horizontalpattern, and the first insulating layer may extend on a second portionof the upper surface of the first horizontal pattern.

According to some embodiments of the inventive concepts, 3Dsemiconductor memory devices may include a substrate including a firstrecess and a second recess that may be in an upper surface of thesubstrate and may be spaced apart from each other in a first direction,a stack structure including a plurality of electrodes stacked on theupper surface of the substrate in a vertical direction, a horizontalstructure that may be between the stack structure and the substrate andmay include a first horizontal pattern and a second horizontal patternthat may be sequentially stacked on the upper surface of the substratein the vertical direction, a vertical pattern extending through theplurality of electrodes and connected to the first horizontal pattern, afirst separation structure extending through the stack structure and thehorizontal structure in the vertical direction and including a portionin the first recess, and a second separation structure extending throughthe stack structure and the horizontal structure in the verticaldirection and including a portion in the second recess. The firstseparation structure and the second separation structure may havedifferent maximum widths in the first direction at respective levels, inthe vertical direction, that are lower than the upper surface of thesubstrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The inventive concepts will become more apparent in view of the attacheddrawings and accompanying detailed description.

FIG. 1 is a schematic circuit diagram illustrating a cell array of athree-dimensional (3D) semiconductor memory device according to someembodiments of the inventive concepts.

FIG. 2 is a plan view illustrating a 3D semiconductor memory deviceaccording to some embodiments of the inventive concepts.

FIGS. 3A, 3B and 3C are cross-sectional views taken along lines A-A′,B-B′ and C-C′ of FIG. 2, respectively, to illustrate a 3D semiconductormemory device according to some embodiments of the inventive concepts.

FIGS. 4A to 4E are enlarged views of a portion ‘AA’ of FIG. 3B.

FIGS. 5A and 5B are enlarged cross-sectional views of a portion ‘BB’ ofFIG. 4A.

FIG. 6 is an enlarged cross-sectional view corresponding to the portion‘AA’ of FIG. 3B to illustrate a 3D semiconductor memory device accordingto some embodiments of the inventive concepts.

FIG. 7A is a cross-sectional view taken along the line B-B′ of FIG. 2 toillustrate a 3D semiconductor memory device according to someembodiments of the inventive concepts.

FIG. 7B is an enlarged cross-sectional view of a portion ‘CC’ of FIG.7A.

FIG. 8 is a cross-sectional view taken along a line D-D′ of FIG. 2 toillustrate a 3D semiconductor memory device according to someembodiments of the inventive concepts.

FIG. 9 illustrates enlarged cross-sectional views of portions ‘DD’ and‘EE’ of FIG. 8.

FIG. 10 is a plan view illustrating a 3D semiconductor memory deviceaccording to some embodiments of the inventive concepts.

FIG. 11 is a cross-sectional view taken along a line E-E′ of FIG. 10 toillustrate a 3D semiconductor memory device according to someembodiments of the inventive concepts.

FIG. 12 illustrates enlarged cross-sectional views of portions ‘FF’ andGG′ of FIG. 11.

FIGS. 13A, 14A, 15A, 16A, 17A and 20A are cross-sectional views takenalong the line B-B′ of FIG. 2 to illustrate a method for manufacturing a3D semiconductor memory device, according to some embodiments of theinventive concepts.

FIGS. 13B and 14B are cross-sectional views taken along the line A-A′ ofFIG. 2 to illustrate a method for manufacturing a 3D semiconductormemory device, according to some embodiments of the inventive concepts.

FIG. 15B is an enlarged view of a portion AAA of FIG. 15A, FIGS. 16B and16C are enlarged views of a portion AAA of FIG. 16A, FIGS. 17B, 18, and19 are enlarged views of a portion AAA of FIG. 17A, and FIGS. 20B and20C are enlarged views of a portion ‘AAA’ of FIG. 20A according to someembodiments of the inventive concepts.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Example embodiments of the inventive concepts will be describedhereinafter in detail with reference to the accompanying drawings.

FIG. 1 is a schematic circuit diagram illustrating a cell array of athree-dimensional (3D) semiconductor memory device according to someembodiments of the inventive concepts.

Referring to FIG. 1, a cell array of a 3D semiconductor memory devicemay include a common source line CSL, a plurality of bit lines BL0 toBL2, and a plurality of cell strings CSTR provided between the commonsource line CSL and the bit lines BL0 to BL2.

The cell strings CSTR may be two-dimensionally arranged along first andsecond directions D1 and D2 and may extend in a third direction D3. Thebit lines BL0 to BL2 may be spaced apart from each other in the firstdirection D1 and may extend in the second direction D2. As used herein,“an element A extends in a direction X” (or similar language) may meanthat the element A extends longitudinally in the direction X.

A plurality of the cell strings CSTR may be connected in parallel toeach of the bit lines BL0 to BL2. The cell strings CSTR may be connectedin common to the common source line CSL. In other words, a plurality ofthe cell strings CSTR may be disposed between a single common sourceline CSL and the plurality of bit lines BL0 to BL2. The common sourceline CSL may be provided in plurality, and the plurality of commonsource lines CSL may be two-dimensionally arranged. In some embodiments,the same voltage may be applied to the plurality of common source linesCSL. In some embodiments, the common source lines CSL may beelectrically controlled independently of each other. As used herein, “anelement A is connected to an element B” (or similar language) may meanthat the element A is electrically and or physically connected to theelement B. The term “and/or” includes any and all combinations of one ormore of the associated listed items.

In some embodiments, each of the cell strings CSTR may include stringselection transistors SST1 and SST2 connected in series to each other,memory cell transistors MCT connected in series to each other, a groundselection transistor GST, and an erase control transistor ECT. Each ofthe memory cell transistors MCT may include a data storage element.

In some embodiments, each of the cell strings CSTR may include first andsecond string selection transistors SST1 and SST2 connected in series toeach other, and the second string selection transistor SST2 may beconnected to one of the bit lines BL0 to BL2. In some embodiments, eachof the cell strings CSTR may include a single string selectiontransistor. In some embodiments, in each of the cell strings CSTR, theground selection transistor GST may include a plurality of MOStransistors connected in series to each other, like the first and secondstring selection transistors SST1 and SST2.

Each of the cell strings CSTR may include a plurality of the memory celltransistors MCT respectively disposed at different distances from thecommon source line CSL. The memory cell transistors MCT may be connectedin series between the first string selection transistor SST1 and theground selection transistor GST. The erase control transistor ECT may beconnected between the ground selection transistor GST and the commonsource line CSL. In addition, each of the cell strings CSTR may furtherinclude dummy cell transistors DMC which are connected between the firststring selection transistor SST1 and an uppermost one of the memory celltransistors MCT and between the ground selection transistor GST and alowermost one of the memory cell transistors MCT, respectively.

In some embodiments, the first string selection transistor SST1 may becontrolled by a first string selection line SSL1, and the second stringselection transistor SST2 may be controlled by a second string selectionline SSL2. The memory cell transistors MCT may be controlled by wordlines WL0 to WLn, respectively, and the dummy cell transistors DMC maybe controlled by dummy word lines DWL, respectively. The groundselection transistor GST may be controlled by a ground selection lineGSL0, GSL1 or GSL2, and the erase control transistor ECT may becontrolled by an erase control line ECL. The common source line CSL maybe connected in common to sources of the erase control transistors ECT.

Gate electrodes of the memory cell transistors MCT (or the dummy celltransistors DMC) disposed at substantially the same level (or distance)from the common source line CSL may be connected in common to one of theword lines WL0 to WLn and DWL so as to be in an equipotential state. Insome embodiments, even though the gate electrodes of the memory celltransistors MCT are disposed at substantially the same level from thecommon source line CSL, the gate electrodes disposed in one row (or onecolumn) may be controlled independently of the gate electrodes disposedin another row (or another column).

The ground selection lines GSL0 to GSL2 and the string selection linesSSL1 and SSL2 may extend in the first direction D1 and may be spacedapart from each other in the second direction D2. The ground selectionlines GSL0 to GSL2 disposed at substantially the same level from thecommon source line CSL may be electrically isolated from each other, andthe string selection lines SSL1 or SSL2 disposed at substantially thesame level from the common source line CSL may be electrically isolatedfrom each other. In addition, the erase control transistors ECT of thecell strings CSTR different from each other may be controlled in commonby the erase control line ECL. The erase control transistors ECT maygenerate a gate induced drain leakage (GIDL) in an erase operation ofthe cell array. According to some embodiments, in the erase operation ofthe cell array, an erase voltage may be applied to the bit line and/orthe common source line CSL, and the GIDL current may be generated fromthe string selection transistor SST2 and/or the erase control transistorECT.

FIG. 2 is a plan view illustrating a 3D semiconductor memory deviceaccording to some embodiments of the inventive concepts. FIGS. 3A, 3Band 3C are cross-sectional views taken along lines A-A′, B-B′ and C-C′of FIG. 2, respectively, to illustrate a 3D semiconductor memory deviceaccording to some embodiments of the inventive concepts. FIGS. 4A to 4Eare enlarged views of a portion ‘AA’ of FIG. 3B. FIGS. 5A and 5B areenlarged cross-sectional views of a portion ‘BB’ of FIG. 4A.

Referring to FIGS. 2 and 3A to 3C, a 3D semiconductor memory deviceaccording to some embodiments may include a peripheral logic structurePS and a cell array structure CS disposed on the peripheral logicstructure PS.

The peripheral logic structure PS may include peripheral logic circuitsPTR integrated on a lower substrate 10 and a lower insulating layer 50covering the peripheral logic circuits PTR. “An element A covering anelement B” (or similar language) as used herein means that the element Ais on the element B but does not necessarily mean that the element Acovers the element B entirely.

The lower substrate 10 may include a silicon substrate, asilicon-germanium substrate, a germanium substrate, or asingle-crystalline epitaxial layer grown on a single-crystalline siliconsubstrate. The lower substrate 10 may include active regions defined bya device isolation layer 13.

The peripheral logic circuits PTR may be disposed on the active regions.The peripheral logic circuits PTR may include row and column decoders, apage buffer, and/or a control circuit. More particularly, the peripherallogic circuits PTR may include a peripheral gate insulating layer on thelower substrate 10, a peripheral gate electrode on the peripheral gateinsulating layer, and source/drain regions disposed in the active regionat both sides of the peripheral gate electrode.

Peripheral circuit interconnection lines 33 may be electricallyconnected to the peripheral logic circuits PTR through peripheralcontact plugs 31. For example, the peripheral contact plugs 31 and theperipheral circuit interconnection lines 33 may be connected to NMOS andPMOS transistors.

The lower insulating layer 50 may be provided on an entire top surfaceof the lower substrate 10. The lower insulating layer 50 may cover theperipheral logic circuits PTR, the peripheral contact plugs 31, and theperipheral circuit interconnection lines 33 on the lower substrate 10.The lower insulating layer 50 may include a plurality of stackedinsulating layers. For example, the lower insulating layer 50 mayinclude at least one of a silicon oxide layer, a silicon nitride layer,a silicon oxynitride layer, or a low-k dielectric layer.

The cell array structure CS may be disposed on the lower insulatinglayer 50. The cell array structure CS may include a horizontalsemiconductor layer 100, a horizontal structure SC, stack structures ST,and vertical structures VS. In some embodiments, the cell strings CSTRillustrated in FIG. 1 may be integrated on the horizontal semiconductorlayer 100. The stack structures ST and the vertical structures VS mayconstitute the cell strings CSTR illustrated in FIG. 1. The horizontalsemiconductor layer 100 may be referred to as a substrate.

More particularly, the horizontal semiconductor layer 100 may bedisposed on a top surface of the lower insulating layer 50. Thehorizontal semiconductor layer 100 may be formed of a semiconductormaterial. For example, the horizontal semiconductor layer 100 mayinclude at least one of silicon (Si), germanium (Ge), silicon-germanium(SiGe), gallium-arsenic (GaAs), indium-gallium-arsenic (InGaAs), oraluminum-gallium-arsenic (AlGaAs). The horizontal semiconductor layer100 may include a semiconductor material doped with dopants of a firstconductivity type (e.g., an N-type) and/or an intrinsic semiconductormaterial not doped with dopants. The horizontal semiconductor layer 100may have a crystal structure including at least one of asingle-crystalline structure, an amorphous structure, or apoly-crystalline structure.

The horizontal structure SC may be disposed between the stack structureST and the horizontal semiconductor layer 100. The horizontal structureSC may be parallel to the top surface of the horizontal semiconductorlayer 100 and may extend in the first direction D1 and the seconddirection D2 in parallel to the stack structure ST. The horizontalstructure SC may be the common source line CSL described with referenceto FIG. 1. The horizontal structure SC may include a first horizontalpattern SCP1 and a second horizontal pattern SCP2 on the firsthorizontal pattern SCP1. The first and second horizontal patterns SCP1and SCP2 may be sequentially stacked on the horizontal semiconductorlayer 100. The first and second horizontal patterns SCP1 and SCP2 may beformed of a semiconductor material doped with dopants having the firstconductivity type, e.g., phosphorus (P) or arsenic (As). In someembodiments, each of the first and second horizontal patterns SCP1 andSCP2 may be formed of a semiconductor material doped with N-typedopants, and a concentration of the N-type dopants in the firsthorizontal pattern SCP1 may be greater than a concentration of theN-type dopants in the second horizontal pattern SCP2.

The stack structure ST may be disposed on the horizontal semiconductorlayer 100. The stack structure ST may be spaced apart from thehorizontal semiconductor layer 100 with the horizontal structure SCinterposed therebetween. The horizontal semiconductor layer 100 may havethe top surface extending in the first direction D1 and the seconddirection D2 perpendicular to the first direction D1. The horizontalsemiconductor layer 100 may include a cell array region CAR and aconnection region CNR, which are arranged in the second direction D2.The stack structure ST may extend from the cell array region CAR ontothe connection region CNR in the second direction D2 and may have astaircase structure on the connection region CNR. The stack structure STmay include electrodes EGE, GGE, CGE and SGE stacked in the thirddirection D3 (e.g., a vertical direction) perpendicular to the first andsecond directions D1 and D2. Lengths of the electrodes of the stackstructure ST in the second direction D2 may sequentially decrease as avertical distance from the lower substrate 10 increases, and a height ofthe stack structure ST may decrease as a horizontal distance from thecell array region CAR increases. Each of the electrodes may have a padportion on the connection region CNR, and the pad portions of theelectrodes may be located at positions horizontally and verticallydifferent from each other.

In some embodiments, the electrodes EGE, GGE, CGE and SGE may include anerase control gate electrode EGE adjacent to the horizontal structureSC, a ground selection gate electrode GGE on the erase control gateelectrode EGE, a plurality of cell gate electrodes CGE sequentiallystacked on the ground selection gate electrode GGE, and a stringselection gate electrode SGE on an uppermost one of the cell gateelectrodes CGE.

The erase control gate electrode EGE may be adjacent to the horizontalstructure SC and may be used as gate electrodes of the erase controltransistors ECT (see FIG. 1) for controlling an erase operation of amemory cell array. The erase control gate electrode EGE may be used asthe gate electrodes of the erase control transistors ECT (see FIG. 1)which are used to generate the gate induced drain leakage (GIDL). Theground selection gate electrode GGE may be used as gate electrodes ofthe ground selection transistors GST (see FIG. 1) for controllingelectrical connection between the common source line CSL (see FIG. 1)and vertical patterns VC of the vertical structures VS. The cell gateelectrodes CGE may be used as control gate electrodes WL0 to WLn and DWL(see FIG. 1) of the memory and dummy cell transistors MCT and DMC (seeFIG. 1). The string selection gate electrode SGE corresponding to anuppermost one of the electrodes EGE, GGE, CGE and SGE may be used asgate electrodes of the string selection transistors SST2 (see FIG. 1)for controlling electrical connection between bit lines BL and thevertical patterns VC. Thicknesses of insulating layers ILD between thecell gate electrodes CGE may be substantially equal to each other, andan insulating layer ILD between the ground selection gate electrode GGEand the lowermost one of the cell gate electrodes CGE may be thickerthan other insulating layers ILD.

The vertical structures VS may be disposed on the cell array region CARof the horizontal semiconductor layer 100, and dummy vertical structuresDVS may be disposed on the connection region CNR of the horizontalsemiconductor layer 100. The vertical structures VS and the dummyvertical structures DVS may extend in the third direction D3substantially perpendicular to the top surface of the horizontalsemiconductor layer 100 and may penetrate the stack structure ST and thehorizontal structure SC.

The vertical structures VS may be arranged in a line or in a zigzag formin one direction when viewed in a plan view. The dummy verticalstructures DVS may penetrate end portions of the electrodes. Thevertical structure VS may include the vertical pattern VC, a fillinginsulation pattern VI, a data storage pattern DSP, and a bit lineconductive pad PAD.

The vertical pattern VC may have a pipe or macaroni shape. The fillinginsulation pattern VI may fill an empty space surrounded by the verticalpattern VC. The vertical pattern VC may include a semiconductor materialsuch as silicon (Si), germanium (Ge), or a combination thereof. Inaddition, the vertical pattern VC may include a semiconductor materialdoped with dopants or an intrinsic semiconductor material not doped withdopants. The vertical pattern VC may include, for example, apoly-crystalline semiconductor material. The vertical pattern VCincluding the semiconductor material may be used as channel regions ofthe erase control, string selection, ground selection and memory celltransistors ECT, SST2, GST and MCT described with reference to FIG. 1.The vertical pattern VC may be electrically connected to a bit line BLthrough the bit line conductive pad PAD. “An element A filling anelement B” (or similar language) as used herein may mean that theelement A is in the element B but does not necessarily mean that theelement A fills the element B entirely.

The data storage pattern DSP may be disposed between the stack structureST and the vertical pattern VC. The data storage pattern DSP may extendin the third direction D3 and may surround a sidewall of the verticalpattern VC. The data storage pattern DSP may have a pipe or macaronishape. A bottom surface of the data storage pattern DSP may be disposedat a lower level than a bottom surface of the erase control gateelectrode EGE and may be in contact with the first horizontal patternSCP1.

The dummy vertical structure DVS may be disposed on the connectionregion CNR of the horizontal semiconductor layer 100. The dummy verticalstructure DVS may penetrate the pad portions of the electrodes, whichare located on the connection region CNR. In some embodiments, a widthof the dummy vertical structure DVS may be greater than a width of thevertical structure VS. In addition, the dummy vertical structure DVS mayhave substantially the same stack structure and materials as thevertical structure VS.

An upper planarization insulating layer 150 may be disposed on thehorizontal semiconductor layer 100 to cover the staircase structure ofthe stack structure ST. The upper planarization insulating layer 150 mayhave a substantially flat top surface and may include a singleinsulating layer or a plurality of stacked insulating layers. The upperplanarization insulating layer 150 may include, for example, a siliconoxide layer and/or a low-k dielectric layer.

A plurality of separation structures SS may be provided on thehorizontal semiconductor layer 100. The separation structures SS may bearranged in the first direction D1 and may extend in the seconddirection D2 to intersect the stack structure ST. In some embodiments,the separation structures SS may be spaced apart from each other in thefirst direction D1 as illustrated in FIG. 2. Each of the separationstructures SS may penetrate the stack structure ST and the horizontalstructure SC and may be inserted in the horizontal semiconductor layer100. Thus, each of the electrodes EGE, GGE, CGE and SGE in the stackstructure ST may be divided into segments spaced apart from each otherin the first direction D1 with the separation structure SS interposedtherebetween. The separation structure SS may extend from the cell arrayregion CAR onto the connection region CNR. The separation structure SSmay be located between the vertical structures VS on the cell arrayregion CAR. The separation structure SS may be located between cellcontact plugs CPLG on the connection region CNR. A bottom end of theseparation structure SS may be located at a lower level than the topsurface of the horizontal semiconductor layer 100, and a top end of theseparation structure SS may be located at a higher level than a topsurface of the stack structure ST. The separation structure SS mayinclude an insulating material. The separation structure SS may include,for example, at least one of silicon oxide or silicon nitride.

More particularly, referring to FIGS. 2, 3A to 3C and 4A, the datastorage pattern DSP may include a plurality of thin layers. The datastorage pattern DSP may be a data storage layer of a NAND flash memorydevice and may include a tunnel insulating layer TIL, a charge storagelayer CIL and a blocking insulating layer BLK, which are sequentiallystacked on a sidewall of the vertical pattern VC. For example, thecharge storage layer CIL may include a trap insulating layer, a floatinggate electrode, and/or an insulating layer including conductive nanodots. The charge storage layer CIL may include at least one of a siliconnitride layer, a silicon oxynitride layer, a silicon-rich nitride layer,a nano-crystalline silicon layer, or a laminated trap layer. The tunnelinsulating layer TIL may include at least one of materials of whichenergy band gaps are greater than that of the charge storage layer CIL.The blocking insulating layer BLK may include, for example, a high-kdielectric layer such as an aluminum oxide layer and/or a hafnium oxidelayer.

The first horizontal pattern SCP1 may penetrate the data storage patternDSP and the vertical pattern VC and may be connected to the verticalpattern VC. The first horizontal pattern SCP1 may have a sidewallportion adjacent to the filling insulation pattern VI, and a thicknessof the sidewall portion may be greater than a thickness of anotherportion, extending in a horizontal direction, of the first horizontalpattern SCP1. The sidewall portion of the first horizontal pattern SCP1may cover a portion of a sidewall of the second horizontal pattern SCP2.

The horizontal semiconductor layer 100 may have a recess region RSadjacent to its top surface. The recess region RS may be recessed fromthe top surface of the horizontal semiconductor layer 100. The recessregion RS may have a shape which is concave from the top surface of thehorizontal semiconductor layer 100 toward a bottom surface of thehorizontal semiconductor layer 100. A lower portion of the separationstructure SS may be inserted in the horizontal semiconductor layer 100to fill the recess region RS.

The separation structure SS may vertically penetrate the stack structureST and the horizontal structure SC, as illustrated in FIG. 3B. Thus,each of the horizontal structure SC and the electrodes EGE, GGE, CGE andSGE of the stack structure ST may have inner sidewalls facing each otherin the first direction D1 with the separation structure SS interposedtherebetween. In some embodiments, the inner sidewalls of each of thehorizontal structure SC and the electrodes EGE, GGE, CGE and SGE of thestack structure ST may be spaced apart from each other in the firstdirection D1 as illustrated in FIG. 3B.

As illustrated in FIG. 4A, a first insulating layer ILL may be providedbetween the horizontal structure SC and the separation structure SS andbetween the horizontal semiconductor layer 100 and the separationstructure SS. The first insulating layer ILL may cover the innersidewalls of the horizontal structure SC and inner surfaces of therecess region RS. In addition, the first insulating layer ILL may bedisposed between the insulating layers ILD and the electrodes EGE, GGE,CGE and SGE of the stack structure ST and between the data storagepattern DSP and the electrodes EGE, GGE, CGE and SGE. The firstinsulating layer ILL may include, for example, aluminum oxide.

As illustrated in FIGS. 4A and 4B, a lowermost electrode EGE of theelectrodes EGE, GGE, CGE and SGE may have first inner sidewalls sw1facing each other with the separation structure SS interposedtherebetween. The second horizontal pattern SCP2 of the horizontalstructure SC may have second inner sidewalls sw2 facing each other withthe separation structure SS interposed therebetween. The firsthorizontal pattern SCP1 of the horizontal structure SC may have thirdinner sidewalls sw3 facing each other with the separation structure SSinterposed therebetween. The first to third inner sidewalls sw1, sw2 andsw3 may be located on the cell array region CAR, as illustrated in FIGS.2 and 3B.

The first inner sidewalls sw1 of the lowermost electrode EGE may beinclined with respect to a direction (i.e., the third direction D3)perpendicular to the top surface of the horizontal semiconductor layer100. A distance between the first inner sidewalls sw1 in the firstdirection D1 may become progressively less toward the horizontalstructure SC. As illustrated in FIG. 4A, in some embodiments, thedistance between the first inner sidewalls sw1 may have a maximum value(e.g., d1) at the same vertical level as a top surface of the lowermostelectrode EGE. As illustrated in FIG. 4B, in some embodiments, thedistance between the first inner sidewalls sw1 may have a minimum value(e.g., d4) at the same vertical level as a bottom surface of thelowermost electrode EGE.

The second inner sidewalls sw2 of the second horizontal pattern SCP2 mayhave shapes concavely recessed in the first direction D1 and a directionopposite to the first direction D1. In other words, a middle portion ofthe second inner sidewall sw2 may be recessed more than upper and lowerportions of the second inner sidewall sw2. As illustrated in FIG. 4A, insome embodiments, a distance between the second inner sidewalls sw2 mayhave a maximum value (e.g., d2) at a vertical level lower than the uppersurface of the second horizontal pattern SCP2 and higher than the lowersurface of the second horizontal pattern SCP2. For example, the distancebetween the second inner sidewalls sw2 may have a maximum value at thevertical central portion of the second inner sidewalls sw2. In someembodiments, the distance between the second inner sidewalls sw2 mayhave a maximum value around a center of the second inner sidewalls sw2in the third direction D3. As illustrated in FIG. 4B, in someembodiments, the distance between the second inner sidewalls sw2 mayhave a minimum value (e.g., d5) at the same vertical level as the bottomsurface (or the top surface) of the second horizontal pattern SCP2.

The third inner sidewalls sw3 of the first horizontal pattern SCP1 mayhave shapes concavely recessed in the first direction D1 and thedirection opposite to the first direction D1. In other words, a middleportion of the third inner sidewall sw3 may be recessed more than upperand lower portions of the third inner sidewall sw3. As illustrated inFIG. 4A, in some embodiments, a distance between the third innersidewalls sw3 may have a maximum value (e.g., d3) at a vertical centralportion of the second inner sidewalls sw2. In some embodiments, thedistance between the third inner sidewalls sw3 may have a maximum valuearound a center of each third inner sidewall sw3 in the third directionD3. As illustrated in FIG. 4B, in some embodiments, the distance betweenthe third inner sidewalls sw3 may have a minimum value (e.g., d6) at thesame vertical level as the bottom surface (or the top surface) of thefirst horizontal pattern SCP1.

Since the first and second horizontal patterns SCP1 and SCP2 have thehorizontally concave inner sidewalls, the separation structure SS mayhave horizontally convex shapes on the second inner sidewalls sw2 andthe third inner sidewalls sw3.

The second inner sidewall sw2 may be horizontally recessed more than thefirst inner sidewall sw1 and the third inner sidewall sw3. In otherwords, a maximum distance d2 between the second inner sidewalls sw2 maybe greater than a maximum distance d1 between the first inner sidewallssw1 and a maximum distance d3 between the third inner sidewalls sw3.Since the second inner sidewall sw2 is horizontally recessed more thanthe third inner sidewall sw3, a portion of the top surface of the firsthorizontal pattern SCP1 may be exposed. In some embodiments, a portionof the top surface of the first horizontal pattern SCP1 may not becovered by the second horizontal pattern SCP2 as illustrated in FIG. 4A.The first insulating layer ILL may cover the portion of the top surfaceof the first horizontal pattern SCP1. In some embodiments, the firstinsulating layer ILL may contact the portion of the top surface of thefirst horizontal pattern SCP1 as illustrated in FIG. 4A.

As illustrated in FIGS. 4A to 4E, the recess region RS may have apolygonal shape in a cross section of the horizontal semiconductor layer100, taken in the first direction D1. The recess region RS may have anasymmetric shape in the first direction D1. The recess region RS mayhave a bottom surface inclined with respect to the top surface of thehorizontal semiconductor layer 100. The lower portion of the separationstructure SS, which is located in the recess region RS, may have a shapesimilar to the shape of the recess region RS. The lower portion of theseparation structure SS may have a polygonal shape when viewed in across-sectional view taken in the first direction D1. The lower portionof the separation structure SS may have an asymmetric shape in the firstdirection D1.

The separation structure SS may have a maximum width (e.g., w1) in thefirst direction D1 at a vertical level lower than the bottom surface ofthe first horizontal pattern SCP1. In other words, a portion (i.e., thelower portion) of the separation structure SS located in the recessregion RS may have a width in the first direction D1 which is greaterthan that of another portion of the separation structure SS locatedoutside the recess region RS.

A width w1 of the recess region RS may be greater than the maximumdistance d3 between the third inner sidewalls sw3, as illustrated inFIG. 4A.

A depth t1 of the recess region RS may be greater than a thickness t2 ofthe first horizontal pattern SCP1 and a thickness t3 of the secondhorizontal pattern SCP2, as illustrated in FIG. 4C.

A portion of a bottom surface bs of the recess region RS may protrudetoward the horizontal structure SC, as illustrated in FIG. 4D. In otherwords, the horizontal semiconductor layer 100 may have a protrusion PPwhich protrudes toward the horizontal structure SC in the recess regionRS.

The separation structure SS may have a portion vertically overlapped bythe electrodes EGE, GGE, CGE and SGE of the stack structure ST, asillustrated in FIG. 4E. For example, a bottom end SSb of the separationstructure SS may be vertically overlapped by the electrodes EGE, GGE,CGE and SGE of the stack structure ST. As used herein, “an element Aoverlapping an element B in a vertical direction” (or similar language)means that at least one vertical line that intersects both the elementsA and B exists.

Referring again to FIGS. 4A to 4E, an interface layer IPL may beprovided to partially surround the first horizontal pattern SCP1. Theinterface layer IPL may be disposed between the first horizontal patternSCP1 and the second horizontal pattern SCP2 and between the firsthorizontal pattern SCP1 and the horizontal semiconductor layer 100. Inaddition, the interface layer IPL may be disposed between the datastorage pattern DSP and the first horizontal pattern SCP1 and betweenthe vertical pattern VC and the first horizontal pattern SCP1. Theinterface layer IPL may not cover the third inner sidewalls sw3. Theinterface layer IPL may include, for example, a conductive material. Theinterface layer IPL may include, for example, carbon (C). The interfacelayer IPL may further include, for example, nitrogen (N) and oxygen (O).

Referring to FIG. 5A, in some embodiments, a top surface SCP1 t of thefirst horizontal pattern SCP1 may protrude toward the separationstructure SS beyond one of the second inner sidewalls sw2 of the secondhorizontal pattern SCP2 such that the second horizontal pattern SCP2 maynot vertically overlap a first portion of the top surface SCP1 t of thefirst horizontal pattern SCP1, as illustrated in FIG. 5A. The firstinsulating layer ILL may cover the first portion of the top surface SCP1t of the first horizontal pattern SCP1, and the interface layer IPL maycover a second portion of the top surface SCP1 t of the first horizontalpattern SCP1. In some embodiments, the first insulating layer ILL maycontact the first portion of the top surface SCP1 t of the firsthorizontal pattern SCP1, and the interface layer IPL may contact thesecond portion of the top surface SCP1 t of the first horizontal patternSCP1, as illustrated in FIG. 5A.

In some embodiments, a bottom surface SCP1 b of the first horizontalpattern SCP1 may protrude toward the separation structure SS beyond asidewall of the recess region RS as illustrated in FIG. 5A. Theinterface layer IPL may cover a first portion of the bottom surface SCP1b of the first horizontal pattern SCP1, and the first insulating layerILL may cover a second portion of the bottom surface SCP1 b of the firsthorizontal pattern SCP1. In some embodiments, the interface layer IPLmay contact the first portion of the bottom surface SCP1 b of the firsthorizontal pattern SCP1, and the first insulating layer ILL may contactthe second portion of the bottom surface SCP1 b of the first horizontalpattern SCP1 as illustrated in FIG. 5A. In some embodiments, the firstinsulating layer ILL may be in direct contact with the top surface SCP1t and the inner sidewall of the first horizontal pattern SCP1.

Referring to FIG. 5B, a second insulating layer ILI may be disposedbetween the first insulating layer ILL and the horizontal semiconductorlayer 100 and between the first insulating layer ILL and the horizontalstructure SC. The second insulating layer ILI may be in direct contactwith the inner surfaces of the recess region RS of the horizontalsemiconductor layer 100 and the inner sidewalls of the horizontalstructure SC. The second insulating layer ILI may include, for example,at least one of silicon oxide or silicon nitride.

Referring again to FIGS. 2 to 3C, a first interlayer insulating layer121 may be disposed on the stack structure ST and the upperplanarization insulating layer 150, and a second interlayer insulatinglayer 123 may be disposed on the first interlayer insulating layer 121.The separation structure SS may penetrate the first interlayerinsulating layer 121. The second interlayer insulating layer 123 maycover a top surface of the separation structure SS. Bit lines BL may bedisposed on the second interlayer insulating layer 123. The bit lines BLmay extend in the first direction D1. The bit lines BL may beelectrically connected to the bit line conductive pads PAD through bitline contact plugs BPLG.

FIG. 6 is an enlarged cross-sectional view corresponding to the portion‘AA’ of FIG. 3B to illustrate a 3D semiconductor memory device accordingto some embodiments of the inventive concepts.

Referring to FIG. 6, the first horizontal pattern SCP1 may penetrate thedata storage pattern DSP so as to be connected to a sidewall of thevertical pattern VC. The first horizontal pattern SCP1 may not penetratethe vertical pattern VC, unlike FIGS. 4A to 4E.

FIG. 7A is a cross-sectional view taken along the line B-B′ of FIG. 2 toillustrate a 3D semiconductor memory device according to someembodiments of the inventive concepts. FIG. 7B is an enlargedcross-sectional view of a portion ‘CC’ of FIG. 7A.

Referring to FIGS. 7A and 7B, a separation structure SS may include acommon source plug CSP and a sidewall spacer SL. The common source plugCSP may be connected to a common source region CSR formed in thehorizontal semiconductor layer 100 between the stack structures ST. Thecommon source plug CSP may be electrically connected to the horizontalstructure SC. For example, the common source plug CSP may include atleast one of a metal (e.g., tungsten, copper, or aluminum), a conductivemetal nitride (e.g., titanium nitride or tantalum nitride), or atransition metal (e.g., titanium or tantalum). In some embodiments, thecommon source plug CSP may have a substantially uniform upper width andmay extend in the second direction D2. The sidewall spacer SL formed ofan insulating material may be disposed between the common source plugCSP and the stack structure ST. The common source region CSR may includeN-type dopants and may extend in the second direction D2 in parallel tothe stack structures ST. In some embodiments, the common source regionCSR may be omitted.

FIG. 8 is a cross-sectional view taken along a line D-D′ of FIG. 2 toillustrate a 3D semiconductor memory device according to someembodiments of the inventive concepts. FIG. 9 illustrates enlargedcross-sectional views of portions ‘DD’ and ‘EE’ of FIG. 8. Hereinafter,the descriptions to the same or similar components as mentioned withreference to FIGS. 1 to 7B may be omitted for the purpose of ease andconvenience in explanation.

Referring to FIGS. 8 and 9, a first separation structure SS1 may beprovided on one sidewall of the stack structure ST, and a secondseparation structure SS2 may be provided on another sidewall of thestack structure ST. The first and second separation structures SS1 andSS2 may be two, adjacent to each other in the first direction D1, of theplurality of separation structures SS. In some embodiments, noseparation structure is provided between the first and second separationstructures SS1 and SS2 as illustrated in FIG. 8.

The first and second separation structures SS1 and SS2 may havedifferent lengths in a vertical direction (i.e., the third directionD3). The first separation structure SS1 may fill a first recess regionRS1 of the horizontal semiconductor layer 100, and the second separationstructure SS2 may fill a second recess region RS2 of the horizontalsemiconductor layer 100. A depth t4 of the first recess region RS1 maybe different from a depth t5 of the second recess region RS2. In someembodiments, the depth t5 of the second recess region RS2 may be greaterthan the depth t4 of the first recess region RS1, and thus the length ofthe second separation structure SS2 in the vertical direction may begreater than the length of the first separation structure SS1 in thevertical direction.

A width w3 of the second recess region RS2 may be greater than a widthw2 of the first recess region RS1. Thus, a width of a lower portion ofthe second separation structure SS2 may be greater than a width of alower portion of the first separation structure SS1.

FIG. 10 is a plan view illustrating a 3D semiconductor memory deviceaccording to some embodiments of the inventive concepts. FIG. 11 is across-sectional view taken along a line E-E′ of FIG. 10 to illustrate a3D semiconductor memory device according to some embodiments of theinventive concepts. FIG. 12 illustrates enlarged cross-sectional viewsof portions ‘FF’ and ‘GG’ of FIG. 11. Hereinafter, the descriptions tothe same or similar components as mentioned with reference to FIGS. 1 to9 may be omitted for the purpose of ease and convenience in explanation.

Referring to FIGS. 10 to 12, a 3D semiconductor memory device accordingto some embodiments of the inventive concepts may include athrough-interconnection structure THV.

The through-interconnection structure THV may penetrate portions of thestack structures ST and a portion of the horizontal semiconductor layer100. In some embodiments, the through-interconnection structure THV maypenetrate a portion of the stack structure ST, which is spaced apartfrom the staircase structure of the stack structure ST. In other words,the through-interconnection structure THV may be disposed on the cellarray region CAR. The through-interconnection structure THV may beadjacent to one of the separation structures SS in the first directionD1. Some of the vertical structures VS may be disposed between thethrough-interconnection structure THV and the one of the separationstructures SS. The some of the vertical structures VS may be dummyvertical structures not constituting the cell strings CSTR of FIG. 1.The through-interconnection structure THV may include athrough-insulating pattern 200, through-plugs PPLG penetrating thethrough-insulating pattern 200, and conductive lines DL connected to thethrough-plugs PPLG. The through-plugs PPLG may penetrate thethrough-insulating pattern 200 so as to be connected to the peripheralcircuit interconnection lines 33 of the peripheral logic structure PS.

A vertical length of a second separation structure SS2 closest to thethrough-interconnection structure THV may be greater than a verticallength of a first separation structure SS1, as illustrated in FIGS. 11and 12. More particularly, a depth t5 of a second recess region RS2filled with the second separation structure SS2 may be greater than adepth t4 of a first recess region RS1 filled with the first separationstructure SS1. Here, a width w3 of the second recess region RS2 may begreater than a width w2 of the first recess region RS1.

[Manufacturing Method]

FIGS. 13A, 14A, 15A, 16A, 17A and 20A are cross-sectional views takenalong the line B-B′ of FIG. 2 to illustrate a method for manufacturing a3D semiconductor memory device, according to some embodiments of theinventive concepts. FIGS. 13B and 14B are cross-sectional views takenalong the line A-A′ of FIG. 2 to illustrate a method for manufacturing a3D semiconductor memory device, according to some embodiments of theinventive concepts. FIG. 15B is an enlarged view of a portion AAA ofFIG. 15A, FIGS. 16B and 16C are enlarged views of a portion AAA of FIG.16A, FIGS. 17B, 18, and 19 are enlarged views of a portion AAA of FIG.17A, and FIGS. 20B and 20C are enlarged views of a portion ‘AAA’ of FIG.20A to illustrate a method for manufacturing a 3D semiconductor memorydevice, according to some embodiments of the inventive concepts.

Referring to FIGS. 13A and 13B, a peripheral logic structure PS may beformed on a lower substrate 10. The lower substrate 10 may be, forexample, a bulk silicon substrate. A device isolation layer 13 may beformed in the lower substrate 10 to define active regions.

The formation of the peripheral logic structure PS may include formingperipheral logic circuits PTR on the lower substrate 10, formingperipheral interconnection structures 31 and 33 connected to theperipheral logic circuits PTR, and forming a lower insulating layer 50.Here, the peripheral logic circuits PTR may include MOS transistorsusing portions of the lower substrate 10 as channels. For example, theformation of the peripheral logic circuits PTR may include forming thedevice isolation layer 13 defining the active regions in the lowersubstrate 10, forming a peripheral gate insulating layer and aperipheral gate electrode which are sequentially stacked on the lowersubstrate 10, and forming source/drain regions by adding (e.g.,injecting) dopants into the lower substrate 10 at both sides of theperipheral gate electrode. Peripheral gate spacers may be formed on bothsidewalls of the peripheral gate electrode.

The lower insulating layer 50 may include a single insulating layer or aplurality of stacked insulating layers, which covers the peripherallogic circuits PTR. For example, the lower insulating layer 50 mayinclude at least one of a silicon oxide layer, a silicon nitride layer,a silicon oxynitride layer, or a low-k dielectric layer.

The formation of the peripheral interconnection structures 31 and 33 mayinclude forming peripheral contact plugs 31 penetrating portions of thelower insulating layer 50, and forming peripheral circuitinterconnection lines 33 connected to the peripheral contact plugs 31.

A horizontal semiconductor layer 100 may be formed by depositing asemiconductor material on the lower insulating layer 50. For example,the horizontal semiconductor layer 100 may include at least one ofsilicon (Si), germanium (Ge), silicon-germanium (SiGe), gallium-arsenic(GaAs), indium-gallium-arsenic (InGaAs), or aluminum-gallium-arsenic(AlGaAs). The horizontal semiconductor layer 100 may include asemiconductor material doped with dopants and/or an intrinsicsemiconductor material not doped with dopants. The horizontalsemiconductor layer 100 may have a crystal structure including at leastone of a single-crystalline structure, an amorphous structure, or apoly-crystalline structure.

A first buffer insulating layer 17 may be formed on the horizontalsemiconductor layer 100, and a lower sacrificial layer LSL may be formedon the first buffer insulating layer 17. The first buffer insulatinglayer 17 may be formed by thermally oxidizing a surface of thehorizontal semiconductor layer 100 or may be formed by depositing asilicon oxide layer.

The lower sacrificial layer LSL may be formed of a material having anetch selectivity with respect to the first buffer insulating layer 17.For example, the lower sacrificial layer LSL may be formed of at leastone of a silicon nitride layer, a silicon oxynitride layer, a siliconcarbide layer, or a silicon-germanium layer. The formation of the lowersacrificial layer LSL may include depositing a lower sacrificial layeron an entire top surface of the horizontal semiconductor layer 100,forming a first mask pattern (not shown) exposing portions of thedeposited lower sacrificial layer, and etching the deposited lowersacrificial layer using the first mask pattern as an etch mask to exposethe first buffer insulating layer 17 or the horizontal semiconductorlayer 100. Thus, openings may be formed in the lower sacrificial layerLSL provided on the connection region CNR.

A second buffer insulating layer 19 and a second horizontal pattern SCP2may be sequentially deposited with uniform thicknesses on the lowersacrificial layer LSL. The second buffer insulating layer 19 and thesecond horizontal pattern SCP2 may also be formed in the openings of thelower sacrificial layer LSL. In some embodiments, the second bufferinsulating layer 19 may be omitted, and the second horizontal patternSCP2 may be deposited directly on the lower sacrificial layer LSL. Forexample, the second buffer insulating layer 19 may be a silicon oxidelayer, and the second horizontal pattern SCP2 may be a poly-siliconlayer doped with N-type dopants and/or carbon (C).

Referring to FIGS. 14A and 14B, insulating layers ILD and uppersacrificial layers USL may be vertically and alternately stacked on thesecond horizontal pattern SCP2, thereby forming a mold structure ML. Inthe mold structure ML, the upper sacrificial layers USL may be formed ofa material having an etch selectivity with respect to the insulatinglayers ILD. For example, the upper sacrificial layers USL may be formedof a different insulating material from that of the insulating layersILD. The upper sacrificial layers USL may be formed of the same materialas the lower sacrificial layer LSL. For example, each of the uppersacrificial layers USL may be formed of a silicon nitride layer, andeach of the insulating layers ILD may be formed of a silicon oxidelayer. Thicknesses of the upper sacrificial layers USL may besubstantially equal to each other, and a thickness of at least one ofthe insulating layers ILD may be different from that (those) of other(s)of the insulating layers ILD.

Referring to FIGS. 15A and 15B, vertical structures VS penetrating themold structure ML may be formed.

The formation of the vertical structures VS may include forming verticalholes vertically penetrating the mold structure ML, and forming a datastorage layer and a vertical pattern VC which are sequentially stackedon an inner surface of each of the vertical holes. The data storagelayer may include a tunnel insulating layer TIL, a charge storage layerCIL, and a blocking insulating layer BLK. A sum of thicknesses of thedata storage layer and the vertical pattern VC on an inner sidewall ofthe vertical hole may be less than about a half of an upper width of thevertical hole. In other words, the data storage layer and the verticalpattern VC may define an empty space in each of the vertical holes, andthe empty space may be filled with a filling insulation pattern VI.

Subsequently, a bit line conductive pad PAD may be formed on a top endof each of the vertical patterns VC. The bit line conductive pad PAD maybe a dopant region doped with dopants or may be formed of a conductivematerial. A bottom surface of the bit line conductive pad PAD may belocated at a higher level than a top surface of an uppermost one of theupper sacrificial layers USL. After the formation of the bit lineconductive pads PAD, a first interlayer insulating layer 121 may beformed on the mold structure ML to cover the bit line conductive padsPAD.

Next, trenches may be formed to penetrate the first interlayerinsulating layer 121 and the mold structure ML, and a preliminarysacrificial spacer layer 130 p may be formed in the trenches.

The formation of the trenches may include forming a mask pattern (notshown) defining planar positions of the trenches on the first interlayerinsulating layer 121, and etching (e.g., anisotropically etching) thefirst interlayer insulating layer 121 and the mold structure ML usingthe mask pattern as an etch mask. Sidewalls of the upper sacrificiallayers USL and sidewalls of the insulating layers ILD may be exposed bythe trenches. In the anisotropic etching process for forming thetrenches, the second buffer insulating layer 19 may be used as an etchstop layer and the second horizontal pattern SCP2 may also be etched.The trenches may expose portions of the second buffer insulating layer19.

Subsequently, the preliminary sacrificial spacer layer 130 p may beformed on inner surfaces of the trenches. The preliminary sacrificialspacer layer 130 p may conformally cover sidewalls and bottom surfacesof the trenches. In other words, the preliminary sacrificial spacerlayer 130 p may cover the sidewalls of the upper sacrificial layers USL,the sidewalls of the insulating layers ILD, sidewalls of the secondhorizontal pattern SCP2, and a top surface of the second bufferinsulating layer 19, which are exposed by the trenches. In someembodiments, the preliminary sacrificial spacer layer 130 p may have auniform thickness along the sidewalls and bottom surfaces of thetrenches as illustrated in FIG. 15A. The preliminary sacrificial spacerlayer 130 p may be formed of a material having an etch selectivity withrespect to the mold structure ML and the lower sacrificial layer LSL.For example, the preliminary sacrificial spacer layer 130 p may beformed of a poly-silicon layer.

Referring to FIGS. 16A and 16B, an etching process (e.g., an anisotropicetching process) may be performed on the preliminary sacrificial spacerlayer 130 p to form a sacrificial spacer layer 130 covering a sidewallof each of the trenches. The second buffer insulating layer 19 under thetrenches may be etched in the anisotropic etching process for formingthe sacrificial spacer layer 130. Thus, the lower sacrificial layer LSLmay be exposed. At this time, portions of the horizontal semiconductorlayer 100 may be exposed in the openings of the lower sacrificial layerLSL.

An etching process (e.g., an isotropic etching process) may be performedon the exposed lower sacrificial layer LSL to form a horizontal recessregion exposing portions of the data storage layers. During theisotropic etching process, the horizontal recess region may be formedusing an etch recipe having an etch selectivity with respect to thesacrificial spacer layer 130, the first and second buffer insulatinglayers 17 and 19 and the data storage layer. When the lower sacrificiallayer LSL includes a silicon nitride layer or a silicon oxynitridelayer, the isotropic etching process performed on the lower sacrificiallayer LSL may use an etching solution including phosphoric acid.

The horizontal recess region may horizontally extend from the trenchinto between the second horizontal pattern SCP2 and the horizontalsemiconductor layer 100 and may be an empty space between the secondhorizontal pattern SCP2 and the horizontal semiconductor layer 100. Thehorizontal recess region may expose the portions of the data storagelayers between the second horizontal pattern SCP2 and the horizontalsemiconductor layer 100. When the horizontal recess region is formed,portions of the second horizontal pattern SCP2 in the openings of thelower sacrificial layer LSL may function as supporters supporting themold structure ML such that the mold structure ML may not collapse.

The portions of the data storage layers exposed by the horizontal recessregion may be isotropically etched to form undercut regions exposingportions of the vertical patterns VC. The undercut region may be anempty space vertically extending from the horizontal recess region andmay be defined between the vertical pattern VC and a sidewall of thesecond horizontal pattern SCP2.

Since the isotropic etching process is performed on the data storagelayer, the data storage layer may be divided into a data storage patternand a dummy data storage pattern, which are vertically spaced apart fromeach other. The isotropic etching process performed on the data storagelayer may use an etch recipe having an etch selectivity with respect tothe horizontal semiconductor layer 100, the second horizontal patternSCP2, the vertical pattern VC, and the sacrificial spacer layer 130.

The isotropic etching of the data storage layer may include sequentiallyand isotropically etching the blocking insulating layer BLK, the chargestorage layer CIL and the tunnel insulating layer TIL, which are exposedby the horizontal recess region. In more detail, the isotropic etchingprocess for forming the undercut region may include a first etchingprocess for etching a portion of the blocking insulating layer BLK, asecond etching process for etching a portion of the charge storage layerCIL, and a third etching process for etching a portion of the tunnelinsulating layer TIL. The first, second and third etching processes maybe sequentially performed. For example, the first and third etchingprocesses may use an etching solution including hydrofluoric acid orsulfuric acid, and the second etching process may use an etchingsolution including phosphoric acid. The first and second bufferinsulating layers 17 and 19 may be removed in the isotropic etchingprocess of the data storage layer. Next, the portions of the verticalpatterns VC exposed by the horizontal recess region may be removed toexpose portions of the filling insulation patterns VI. In someembodiments, the process for removing the exposed portions of thevertical patterns VC may be omitted. Subsequently, an interface layerIPL may be formed on inner surfaces of the horizontal recess region andthe undercut regions, as illustrated in FIG. 16C. Next, the sacrificialspacer layer 130 on the sidewall of the trench may be removed.

Referring to FIGS. 17A and 17B, a preliminary horizontal pattern SCP1 pmay be formed in the undercut regions, the horizontal recess region, andthe trench. The preliminary horizontal pattern SCP1 p may be formedusing a chemical vapor deposition (CVD) process or an atomic layerdeposition (ALD) process. The preliminary horizontal pattern SCP1 p maybe, for example, a semiconductor layer doped with dopants, for example,N-type dopants.

The preliminary horizontal pattern SCP1 p may cover the inner surfacesof the undercut region, the horizontal recess region and the trench bythe deposition process. The preliminary horizontal pattern SCP1 p maynot completely fill the trench and may define a gap region in thetrench. The preliminary horizontal pattern SCP1 p may be connected toportions of the vertical patterns VC under the second horizontal patternSCP2 through the interface layer IPL.

In more detail, a semiconductor source gas may be supplied into theundercut region, the horizontal recess region, and the trench in thedeposition process for forming the preliminary horizontal pattern SCP1p, and thus a semiconductor material may be deposited on the innersurfaces of the undercut region, the horizontal recess region and thetrench.

When the preliminary horizontal pattern SCP1 p is formed, a depositionrate of the semiconductor material may be changed depending oncharacteristics of a surface exposed by the horizontal recess region. Inother words, a deposition rate of the semiconductor material on a topsurface of the horizontal semiconductor layer 100 may be different froma deposition rate of the semiconductor material on a bottom surface ofthe second horizontal pattern SCP2. In addition, when the preliminaryhorizontal pattern SCP1 p is formed, a crystal structure of thesemiconductor material may be determined depending on a crystalstructure of the surface exposed by the horizontal recess region. Insome embodiments, a thickness of the semiconductor material deposited onthe top surface of the horizontal semiconductor layer 100 may be lessthan a thickness of the semiconductor material deposited on the bottomsurface of the second horizontal pattern SCP2. In some embodiments, athickness of the semiconductor material deposited on the top surface ofthe horizontal semiconductor layer 100 may be substantially equal to athickness of the semiconductor material deposited on the bottom surfaceof the second horizontal pattern SCP2.

Referring to FIGS. 18 and 19, an etching process may be performed on thepreliminary horizontal pattern SCP1 p and the horizontal semiconductorlayer 100. Thus, a first horizontal pattern SCP1 and a recess region RSmay be formed. The etching process on the preliminary horizontal patternSCP1 p and the horizontal semiconductor layer 100 may be performed usingan etch recipe including ADM (ammonia deionized mixture). The etchingprocess on the preliminary horizontal pattern SCP1 p and the horizontalsemiconductor layer 100 may use ADM as an etchant.

Referring to FIGS. 20A and 20B, an etching process for removing theupper sacrificial layers USL may be performed. Next, as illustrated inFIG. 20C, a first insulating layer ILL may be conformally formed inspaces formed by the removal of the upper sacrificial layers USL. Insome embodiments, the first insulating layer ILL may have a uniformthickness as illustrated in FIG. 20C.

Referring again to FIGS. 3A and 3B, the stack structure ST describedabove may be formed by performing processes for forming electrodes EGE,GGE, CGE and SGE in the spaces formed by the removal of the uppersacrificial layers USL.

After the formation of the stack structure ST, a separation structure SSmay be formed in the trench and the recess region RS. In someembodiments, the separation structure SS may include the common sourceplug CSP and the sidewall spacer SL, as illustrated in FIGS. 7A and 7B.In this case, the formation of the sidewall spacer SL may includedepositing a spacer layer with a uniform thickness on the horizontalsemiconductor layer 100 on which the stack structure ST is formed, andperforming an etch-back process on the spacer layer to expose thehorizontal semiconductor layer 100. Subsequently, a conductive layer maybe deposited to fill the trench and the recess region RS which have thesidewall spacer SL, and then, the deposited conductive layer may beplanarized until a top surface of the first interlayer insulating layer121 is exposed, thereby forming the common source plug CSP. The commonsource plug CSP may be connected to the horizontal semiconductor layer100.

Thereafter, a second interlayer insulating layer 123 may be formed onthe first interlayer insulating layer 121 to cover a top surface of theseparation structure SS. Bit line contact plugs BPLG may be formed topenetrate the second and first interlayer insulating layers 123 and 121.The bit line contact plugs BPLG may be connected to the bit lineconductive pads PAD. The bit lines BL described above may be formed onthe second interlayer insulating layer 123.

According to some embodiments of the inventive concepts, operatingcharacteristics and reliability of the 3D semiconductor memory devicemay be improved, and the 3D semiconductor memory device may be easilymanufactured.

While the inventive concepts have been described with reference toexample embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the scopes of the inventive concepts.

Therefore, it should be understood that the embodiments described hereinare not limiting, but illustrative. Thus, the scopes of the inventiveconcepts are to be determined by the broadest permissible interpretationof the following claims and their equivalents, and shall not berestricted or limited by the foregoing description.

1. A three-dimensional (3D) semiconductor memory device comprising: ahorizontal structure on an upper surface of a substrate, the horizontalstructure comprising a first horizontal pattern and a second horizontalpattern that are sequentially stacked on the upper surface of thesubstrate in a vertical direction; a stack structure comprising aplurality of electrodes stacked on the horizontal structure in thevertical direction; a vertical pattern extending through the pluralityof electrodes and connected to the first horizontal pattern; and aseparation structure intersecting the stack structure and the horizontalstructure and protruding into the upper surface of the substrate,wherein a lowermost electrode of the plurality of electrodes comprisesfirst inner sidewalls that face each other and are spaced apart fromeach other in a first direction with the separation structure interposedtherebetween, and the second horizontal pattern comprises second innersidewalls that face each other and are spaced apart from each other inthe first direction with the separation structure interposedtherebetween, and wherein a maximum distance between the first innersidewalls in the first direction is less than a maximum distance betweenthe second inner sidewalls in the first direction.
 2. The 3Dsemiconductor memory device of claim 1, wherein the vertical patterncomprises a plurality of vertical patterns, and the separation structureis between first vertical patterns of the plurality of vertical patternsand second vertical patterns of the plurality of vertical patterns andextends longitudinally in a second direction parallel to the uppersurface of the substrate.
 3. The 3D semiconductor memory device of claim1, wherein the first horizontal pattern comprises third inner sidewallsthat face each other and are spaced apart from each other with theseparation structure interposed therebetween, and a maximum distancebetween the third inner sidewalls in the first direction is less thanthe maximum distance between the second inner sidewalls in the firstdirection.
 4. The 3D semiconductor memory device of claim 1, wherein thefirst horizontal pattern comprises third inner sidewalls that face eachother and are spaced apart from each other in the first direction withthe separation structure interposed therebetween, and wherein a maximumwidth of the separation structure in the first direction is greater thana maximum distance between the third inner sidewalls in the firstdirection.
 5. The 3D semiconductor memory device of claim 1, wherein theseparation structure has a maximum width in the first direction at alevel lower, in the vertical direction, than a lower surface of thefirst horizontal pattern.
 6. The 3D semiconductor memory device of claim1, further comprising: an insulating layer extending between theseparation structure and one of the second inner sidewalls of the secondhorizontal pattern, wherein the insulating layer covers a portion of anupper surface of the first horizontal pattern. 7-10. (canceled)
 11. The3D semiconductor memory device of claim 1, wherein the substrateincludes a recess, and a portion of the separation structure is in therecess, and wherein a depth of the recess in the vertical direction isgreater than a thickness of the first horizontal pattern in the verticaldirection.
 12. (canceled)
 13. (canceled)
 14. A three-dimensional (3D)semiconductor memory device comprising: a substrate, an upper surface ofthe substrate comprising a recess; a stack structure comprising aplurality of electrodes stacked on the upper surface of the substrate ina vertical direction; a horizontal structure between the stack structureand the substrate, the horizontal structure comprising a firsthorizontal pattern and a second horizontal pattern that are sequentiallystacked on the upper surface of the substrate in the vertical direction;and a separation structure intersecting the stack structure and thehorizontal structure in a first direction parallel to the upper surfaceof the substrate, a portion of the separation structure being in therecess of the substrate, wherein the first horizontal pattern comprisesfirst inner sidewalls that face each other and are spaced apart fromeach other in a second direction that is perpendicular to the firstdirection with the separation structure interposed therebetween, andwherein a maximum width of the recess in the second direction is greaterthan a maximum distance between the first inner sidewalls in the seconddirection.
 15. The 3D semiconductor memory device of claim 14, furthercomprising: a plurality of vertical patterns extending through theplurality of electrodes and connected to the first horizontal pattern,wherein the separation structure is between first vertical patterns ofthe plurality of vertical patterns and second vertical patterns of theplurality of vertical patterns.
 16. (canceled)
 17. The 3D semiconductormemory device of claim 14, wherein the portion of the separationstructure in the recess is overlapped in the vertical direction by alowermost electrode of the plurality of electrodes.
 18. The 3Dsemiconductor memory device of claim 14, wherein the second horizontalpattern comprises second inner sidewalls that face each other and arespaced apart from each other in the second direction with the separationstructure interposed therebetween, and wherein a maximum distancebetween the second inner sidewalls in the second direction is greaterthan the maximum distance between the first inner sidewalls in thesecond direction.
 19. (canceled)
 20. The 3D semiconductor memory deviceof claim 14, further comprising: an interface layer extending betweenthe first horizontal pattern and the second horizontal pattern andincluding carbon (C).
 21. A three-dimensional (3D) semiconductor memorydevice comprising: peripheral logic circuits on a lower substrate; alower insulating layer on the peripheral logic circuits; a substrate onthe lower insulating layer, an upper surface of the substrate comprisinga recess; a stack structure comprising a plurality of electrodesvertically stacked on the upper surface of the substrate; a horizontalstructure between the stack structure and the substrate, the horizontalstructure comprising a first horizontal pattern and a second horizontalpattern that are sequentially stacked on the upper surface of thesubstrate; a vertical pattern extending through the plurality ofelectrodes and connected to the first horizontal pattern; a separationstructure intersecting the stack structure and the horizontal structurein a first direction parallel to the upper surface of the substrate, aportion of the separation structure being in the recess of thesubstrate; an interface layer between the first horizontal pattern andthe second horizontal pattern; and a first insulating layer between thesubstrate and the separation structure in the recess of the substrate,wherein the interface layer extends on a first portion of an uppersurface of the first horizontal pattern, and the first insulating layerextends on a second portion of the upper surface of the first horizontalpattern.
 22. (canceled)
 23. (canceled)
 24. The 3D semiconductor memorydevice of claim 21, wherein the interface layer extends on a firstportion of a lower surface of the first horizontal pattern, and thefirst insulating layer extends on a second portion of the lower surfaceof the first horizontal pattern.
 25. The 3D semiconductor memory deviceof claim 21, wherein the first horizontal pattern comprises first innersidewalls that face each other with the separation structure interposedtherebetween, and wherein the interface layer is in direct contact withthe first insulating layer.
 26. The 3D semiconductor memory device ofclaim 21, wherein the first horizontal pattern comprises first innersidewalls facing each other with the separation structure interposedtherebetween, and wherein the interface layer does not cover the firstinner sidewalls.
 27. (canceled)
 28. The 3D semiconductor memory deviceof claim 21, further comprising: a through-interconnection structurecomprising a through-insulating pattern vertically extending through thestack structure and a through-plug vertically extending through thethrough-insulating pattern so as to be connected to the peripheral logiccircuits. 29-34. (canceled)
 35. The 3D semiconductor memory device ofclaim 1, wherein the first horizontal pattern comprises an upper surfacethat comprises a first portion facing the second horizontal pattern anda second portion protruding toward the separation structure beyond oneof the second inner sidewalls of the second horizontal pattern such thatthe second horizontal pattern does not overlap the second portion of theupper surface of the first horizontal pattern in the vertical direction.36. The 3D semiconductor memory device of claim 35, further comprisingan interface layer between the first horizontal pattern and the secondhorizontal pattern, wherein the interface layer comprises carbon (C) ora conductive material, and wherein the interface layer does not overlapthe second portion of the upper surface of the first horizontal patternin the vertical direction.
 37. The 3D semiconductor memory device ofclaim 14, wherein the first horizontal pattern comprises a lower surfacethat comprises a first portion facing the substrate and a second portionprotruding toward the separation structure beyond a sidewall of therecess.